Ludovic Godet2022-01-07T01:34:06-05:00 US 9,996,006: Resist sensitivity and profile improvement via acid anion control during FGPEB
Ludovic Godet2022-01-07T01:21:29-05:00 US 9,927,709: Resist sensitivity and profile improvement via acid anion control during FGPEB
Ludovic Godet2022-01-07T00:40:39-05:00 US 9,829,790: Immersion field guided exposure and post-exposure bake process
Ludovic Godet2022-01-07T00:37:07-05:00 US 9,823,570: Field guided post exposure bake application for photoresist microbridge defects
Ludovic Godet2022-01-07T00:26:57-05:00 US 9,815,091: Roll to roll wafer backside particle and contamination removal
Ludovic Godet2022-01-05T02:05:04-05:00 US 9,798,240: Controlling photo acid diffusion in lithography processes
Ludovic Godet2022-01-05T01:31:08-05:00 US 9,733,579: Tooling Configuration for Electric/Magnetic Field Guided Acid Profile Control in PhotoResist Layer
Ludovic Godet2022-01-05T00:58:46-05:00 US 9,620,335: In-situ Control of Ion Angular Distribution in a Processing Apparatus
Staff2021-01-31T19:27:36-05:00 US 9,514,918: Guard Aperture to Control Ion Angular Distribution in Plasma Processing
Staff2021-01-31T19:24:49-05:00 US 9,502,262: Nanocrystalline Diamond Carbon Film for 3D NAND Hardmask Application
Staff2021-01-31T19:23:37-05:00 US 9,480,140: Material Modification by Neutral Beam Source with Selected Collision Angle
Staff2021-01-31T19:18:41-05:00 US 9,425,027: Methods of Affecting Material Properties and Applications
Staff2021-01-31T19:17:36-05:00 US 9,412,613: Development of High Etch Selectivity Hardmask by Ion Implantation in Carbon Films
Staff2021-01-31T19:10:44-05:00 US 9,382,625: Remote Plasma Source Based Cyclic CVD Process for Nanocrystalline Diamond Deposition
Staff2021-01-31T19:06:53-05:00 US 9,366,966: Electric/magnetic Field Guided Acid Profile Control in a Photoresist Layer
Staff2021-01-31T19:04:51-05:00 US 9,336,998: Apparatus and Method for Dynamic Control of Ion Beam Energy and Angle
Staff2021-01-31T19:03:49-05:00 US 9,293,301: In Situ Control of Ion Angular Distribution in a Processing Apparatus
Staff2021-01-31T19:02:05-05:00 US 9,288,889: Apparatus and Techniques for Energetic Neutral Beam Processing
Staff2021-01-31T18:58:28-05:00 US 9,253,868: Neutral Beam Source with Plasma Sheath-Shaping Neutralization
Staff2021-01-31T18:55:14-05:00 US 9,232,628: Method and System for Plasma –Assisted Ion Beam Processing
Staff2021-01-31T18:54:16-05:00 US 9,214,377: Methods for Silicon Recess Structure in a Substrate by Utilizing a Doping Layer
Staff2021-02-01T11:19:08-05:00 US 9,024,282: Techniques and Apparatus for High Rate Hydrogen Implantation and Co-implant
Staff2021-02-01T11:29:06-05:00 US 9,024,273: Method to Generate Molecular Ions from Ions with a Smaller Atomic Mass
Staff2021-02-01T12:32:37-05:00 US 8,937,004: Apparatus and Method for Controlling Implanting Workpieces
Staff2021-02-05T10:42:54-05:00 US 8,907,300: System and Method for Plasma Control Using Boundary Electrode
Staff2021-02-05T12:09:53-05:00 US 8,698,107: Technique and Apparatus for Monitoring Ion Mass, Energy, and Angle in Processing Systems
Staff2021-02-05T12:43:25-05:00 US 8,592,230: Method for patterning a substrate using ion assisted selective deposition
Staff2021-02-05T12:39:42-05:00 US 8,288,741: Apparatus and Method for Three Dimensional Ion Processing
Staff2021-02-05T12:03:37-05:00 US 7,878,145 : Monitoring plasma ion implantation systems for fault detection and process control
Staff2021-02-05T10:56:15-05:00 US 7,856,100 B2: Closed Loop Control and Process Optimization in Plasma Doping Processes Using Time Of Flight Ion Detector
Staff2021-02-05T10:52:09-05:00 US 7,476,849: Technique for monitoring and controlling a plasma process
Staff2021-02-05T10:48:20-05:00 US 7,453,059: Technique for monitoring and controlling a plasma process
Staff2021-02-02T15:24:32-05:00 US 20090084987: Charge Neutralization In a Plasma Processing Apparatus
Ludovic Godet2022-01-10T14:29:45-05:00 US 10,358,715: Integrated cluster tool for selective area deposition
Ludovic Godet2022-01-10T13:35:28-05:00 US 10,203,604: Method and apparatus for post exposure processing of photoresist wafers
Ludovic Godet2022-01-07T01:54:27-05:00 US 10,108,093: Controlling photo acid diffusion in lithography processes
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