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All PatentsStaff2021-01-31T20:42:57-05:00
  • All
  • Application Based Technology
  • Application Technology [A]
  • Application Technology [G]
  • AT-Battery Technology
  • AT-Biomedical/MEMS
  • AT-Display
  • AT-Integration
  • AT-LED
  • AT-Recrystallization
  • AT-Solar
  • AT-Thermoelectric
  • Hardware Technology
  • Hardware Technology [A]
  • Hardware Technology [G]
  • HT-Ion Source
  • HT-Litho
  • HT-Localized Processing
  • HT-Plasma Apparatus
  • HT-Process Control
  • HT-Uniformity Control
  • Materials Engineering
  • Materials Engineering [G]
  • ME-Deposition
  • ME-Ion Implantation
  • ME-Selective Deposition
  • ME-Selective Processing
  • Plasma Processing [A]
  • Plasma Processing [G]
  • Plasma Processing Technology
  • PP-ALD
  • PP-Doping
  • PP-Etch/Deposition
  • PP-Material Engineering
  • PP-PVD
Ludovic Godet2022-01-07T01:34:06-05:00

US 9,996,006: Resist sensitivity and profile improvement via acid anion control during FGPEB

Ludovic Godet2022-01-07T01:29:19-05:00

US 9,964,863: Post exposure processing apparatus

Ludovic Godet2022-01-07T01:24:55-05:00

US 9,947,539: Plasma poisoning to enable selective deposition

Ludovic Godet2022-01-07T01:21:29-05:00

US 9,927,709: Resist sensitivity and profile improvement via acid anion control during FGPEB

Ludovic Godet2022-01-07T01:18:47-05:00

US 9,911,594: Selective atomic layer deposition process utilizing patterned SAM for 3D structure application

Ludovic Godet2022-01-07T01:04:40-05:00

US 9,865,464: Nanocrystalline diamond carbon film for 3D NAND hardmask application

Ludovic Godet2022-01-07T00:59:59-05:00

US 9,864,276: Laser annealing and electric field,

Ludovic Godet2022-01-07T00:55:46-05:00

US 9,852,902: Material deposition for high aspect ratio structures

Ludovic Godet2022-01-07T00:47:58-05:00

US 9,850,569: Ion implantation for superconductor tape fabrication

Ludovic Godet2022-01-07T00:40:39-05:00

US 9,829,790: Immersion field guided exposure and post-exposure bake process

Ludovic Godet2022-01-07T00:37:07-05:00

US 9,823,570: Field guided post exposure bake application for photoresist microbridge defects

Ludovic Godet2022-01-07T00:26:57-05:00

US 9,815,091: Roll to roll wafer backside particle and contamination removal

Ludovic Godet2022-01-05T02:05:04-05:00

US 9,798,240: Controlling photo acid diffusion in lithography processes

Ludovic Godet2022-01-05T02:00:20-05:00

US 9,777,378: Advanced Process flow for High Quality FCVD films

Ludovic Godet2022-01-05T01:56:10-05:00

US 9,773,675: 3D Materials Modification for Advanced Processing,

Ludovic Godet2022-01-05T01:49:39-05:00

US 9,767,987: Method and System for Modifying Substrate Relief Feature using Ion Implantation

Ludovic Godet2022-01-05T01:43:52-05:00

US 9,754,791: Selective Deposition Utilizing Mask and Directional Plasma Treatment

Ludovic Godet2022-01-05T01:45:12-05:00

US 9,748,148: Localized Stress Modulation for Overlay and EPE

Ludovic Godet2022-01-05T01:31:08-05:00

US 9,733,579: Tooling Configuration for Electric/Magnetic Field Guided Acid Profile Control in PhotoResist Layer

Ludovic Godet2022-01-05T01:11:19-05:00

US 9,716,005: Plasma Poisoning to Enable Selective Deposition

Ludovic Godet2022-01-05T01:04:41-05:00

US 9,620,407: 3D Material Modification for Advanced Processing

Ludovic Godet2022-01-05T00:58:46-05:00

US 9,620,335: In-situ Control of Ion Angular Distribution in a Processing Apparatus

Ludovic Godet2022-01-04T23:48:53-05:00

US 9,613,859: Direct Deposition of Nickel Silicide Nanowire

Ludovic Godet2022-01-04T23:38:56-05:00

US 9,595,467: Air Gap Formation in Interconnection Structure by Implantation Process

Ludovic Godet2022-01-04T23:41:46-05:00

US 9,553,174: Conversion Process Utilized for Manufacturing Advanced 3D Features for Semiconductor Device

Staff2021-01-31T18:33:30-05:00

US 9,515,166: Selective Atomic Layer Deposition Process Utilizing Patterned Self-Assembled Monolayers for 3D Structure Semiconductor Applications

Staff2021-01-31T19:27:36-05:00

US 9,514,918: Guard Aperture to Control Ion Angular Distribution in Plasma Processing

Staff2021-01-31T19:25:57-05:00

US 9,512,517: Multiple Exposure Treatment for Processing a Patterning Feature

Staff2021-01-31T19:24:49-05:00

US 9,502,262: Nanocrystalline Diamond Carbon Film for 3D NAND Hardmask Application

Staff2021-01-31T19:23:41-05:00

US 9,502,258: Anisotropic Gap Etch

Staff2021-01-31T19:23:37-05:00

US 9,480,140: Material Modification by Neutral Beam Source with Selected Collision Angle

Staff2021-01-31T19:19:36-05:00

US 9,460,961: Techniques and Apparatus for Anisotropic Metal Etching

Staff2021-01-31T19:18:41-05:00

US 9,425,027: Methods of Affecting Material Properties and Applications

Staff2021-01-31T19:17:36-05:00

US 9,412,613: Development of High Etch Selectivity Hardmask by Ion Implantation in Carbon Films

Staff2021-01-31T19:16:21-05:00

US 9,396,965: Techniques and Apparatus for Anisotropic Metal Etching

Staff2021-01-31T19:15:07-05:00

US 9,385,219: Method and Apparatus for Selective Deposition

Staff2021-01-31T19:10:44-05:00

US 9,382,625: Remote Plasma Source Based Cyclic CVD Process for Nanocrystalline Diamond Deposition

Staff2021-01-31T19:09:08-05:00

US 9,379,021: Method to Reduce K Value of Dielectric Layer for Advanced FinFET Formation

Staff2021-01-31T19:08:06-05:00

US 9,377,692: Electric/magnetic Field Guided Acid Diffusion

Staff2021-01-31T19:06:53-05:00

US 9,366,966: Electric/magnetic Field Guided Acid Profile Control in a Photoresist Layer

Staff2021-01-31T19:05:56-05:00

US 9,340,877: Method and System for Modifying Photoresist using EM Radiation and Implantation

Staff2021-01-31T19:04:51-05:00

US 9,336,998: Apparatus and Method for Dynamic Control of Ion Beam Energy and Angle

Staff2021-01-31T19:03:49-05:00

US 9,293,301: In Situ Control of Ion Angular Distribution in a Processing Apparatus

Staff2021-01-31T19:02:05-05:00

US 9,288,889: Apparatus and Techniques for Energetic Neutral Beam Processing

Staff2021-01-31T19:00:54-05:00

US 9,280,070: Field guided exposure and post-exposure bake process

Staff2021-01-31T18:59:44-05:00

US 9,268,228: Techniques for Patterning a Substrate

Staff2021-01-31T18:58:28-05:00

US 9,253,868: Neutral Beam Source with Plasma Sheath-Shaping Neutralization

Staff2021-01-31T18:57:20-05:00

US 9,240,350: Techniques for Forming 3D Structures

Staff2021-01-31T18:56:21-05:00

US 9,236,257: Techniques to Mitigate Straggle Damage to Sensitive Structures

Staff2021-01-31T18:55:14-05:00

US 9,232,628: Method and System for Plasma –Assisted Ion Beam Processing

Staff2021-01-31T18:54:16-05:00

US 9,214,377: Methods for Silicon Recess Structure in a Substrate by Utilizing a Doping Layer

Staff2021-01-31T18:52:41-05:00

US 9,190,498: Technique for Forming a FinFET Device using Selective Ion Implantation

Staff2021-01-31T18:51:02-05:00

US 9,136,096: Three-Dimensional Metal Deposition Technique

Staff2021-01-31T18:48:37-05:00

US 9,123,509: Techniques for Plasma Processing a Substrate

Staff2021-01-31T20:33:44-05:00

US 9,118,001: Techniques for Treating Sidewalls of Patterned Structures using Angled Ion Treatment

Staff2021-02-01T09:30:27-05:00

US 9,062,367: Plasma Processing of Workpieces to Form a Coating

Staff2021-02-01T11:19:08-05:00

US 9,024,282: Techniques and Apparatus for High Rate Hydrogen Implantation and Co-implant

Staff2021-02-01T11:29:06-05:00

US 9,024,273: Method to Generate Molecular Ions from Ions with a Smaller Atomic Mass

Staff2021-02-01T11:33:50-05:00

US 8,974,683: Method and System for Modifying Resist Openings using Multiple Angled Ions

Staff2021-02-01T12:13:41-05:00

US 8,969,181: Method for Epitaxial Layer Overgrowth

Staff2021-02-01T12:20:16-05:00

US 8,952,344: Techniques for Processing Photoresist Features using Ions

Staff2021-02-01T12:25:48-05:00

US 8,946,061: Engineering of Porous Coatings Formed by Ion-assisted Direct Deposition

Staff2021-02-01T12:32:37-05:00

US 8,937,004: Apparatus and Method for Controlling Implanting Workpieces

Staff2021-02-03T11:39:05-05:00

US 8,907,307: Apparatus and Method for Maskless Patterned Implantation

Staff2021-02-05T10:42:54-05:00

US 8,907,300: System and Method for Plasma Control Using Boundary Electrode

Staff2021-02-03T11:59:40-05:00

US 8,906,576: Material Engineering for High Performance Li-ion Battery Electrodes

Staff2021-02-04T11:26:34-05:00

US 8,858,816: Enhanced Etch and Deposition Profile Control Using Plasma Sheath Engineering

Staff2021-02-03T11:49:45-05:00

US 8,835,287: Method of Implanting a Workpiece to Improve Growth of a Compound Semiconductor

Staff2021-02-04T11:22:11-05:00

US 8,815,720: Method of Etching a Workpiece

Staff2021-02-04T11:14:27-05:00

US 8,778,603: Method and System for Modifying Substrate Relief Features Using Ion Implantation

Staff2021-02-03T12:04:16-05:00

US 8,778,465: Ion-assisted Direct Growth of Porous Materials

Staff2021-02-05T10:26:17-05:00

US 8,742,373: Method of Ionization

Staff2021-02-05T10:31:05-05:00

US 8,728,951: Method and System for Ion Assisted Processing

Staff2021-02-03T11:34:18-05:00

US 8,716,682: Apparatus and Method for Multiple Slot Ion Implantation

Staff2021-02-04T11:10:37-05:00

US 8,698,109: Method and System for Controlling Critical Dimension and Roughness in Resist Features

Staff2021-02-05T12:09:53-05:00

US 8,698,107: Technique and Apparatus for Monitoring Ion Mass, Energy, and Angle in Processing Systems

Staff2021-02-02T15:41:12-05:00

US 8,697,549: Deposition of Porous Films for Thermoelectric Applications

Staff2021-02-04T11:51:09-05:00

US 8,679,960: Technique for Processing a Substrate Having a Non-planar Surface

Staff2021-02-05T13:30:43-05:00

US 8,664,098: Plasma Processing Apparatus

Staff2021-02-05T10:35:33-05:00

US 8,659,229: Plasma Attenuation for Uniformity Control

Staff2021-02-05T12:47:46-05:00

US 8,623,171: Plasma Processing Apparatus

Staff2021-02-04T11:18:33-05:00

US 8,603,591: Enhanced Etch and Deposition Profile Control using Plasma Sheath Engineering

Staff2021-02-05T12:43:25-05:00

US 8,592,230: Method for patterning a substrate using ion assisted selective deposition

Staff2021-02-03T11:27:38-05:00

US 8,461,030: Apparatus and method for controllably implanting workpieces

Staff2021-02-04T11:06:17-05:00

US 8,460,569: Method and system for post-etch treatment of patterned substrate features

Staff2021-02-03T12:18:41-05:00

US 8,435,727: Method and system for modifying photoresist using electromagnetic radiation and ion implantation

Staff2021-02-04T11:46:46-05:00

US 8,372,735: USJ Techniques with Helium-Treated Substrates

Staff2021-02-03T12:14:09-05:00

US 8,354,655: Method and System for Controlling Critical Dimension and Roughness in Resist Features

Staff2021-02-05T12:39:42-05:00

US 8,288,741: Apparatus and Method for Three Dimensional Ion Processing

Staff2021-02-03T11:54:42-05:00

US 8,288,255: N-type Doping of Zinc Telluride

Staff2021-02-05T12:20:12-05:00

US 8,188,445: Ion Source

Staff2021-02-02T15:44:39-05:00

US 8,187,979: Workpiece Patterning with Plasma Sheath Modulation

Staff2021-02-03T12:09:26-05:00

US 8,133,804: Method and system for modifying patterned photoresist using multi-step ion implantation

Staff2021-02-04T11:41:57-05:00

US 8,124,506: USJ techniques with helium-treated substrates

Staff2021-02-05T12:24:20-05:00

US 8,101,510: Plasma Processing Apparatus

Staff2021-02-02T15:37:21-05:00

US 8,003,498: Particle Beam Assisted Modification of Thin Film Materials

Staff2021-02-04T11:30:51-05:00

US 7,927,986: Ion implantation with heavy halogenide compounds

Staff2021-02-05T12:03:37-05:00

US 7,878,145 : Monitoring plasma ion implantation systems for fault detection and process control

Staff2021-02-05T10:56:15-05:00

US 7,856,100 B2: Closed Loop Control and Process Optimization in Plasma Doping Processes Using Time Of Flight Ion Detector

Staff2021-02-05T12:15:47-05:00

US 7,767,977 : Ion Source

Staff2021-02-05T11:01:18-05:00

US 7,687,787: Profile Adjustment in Plasma Ion Implanter

Staff2021-02-05T10:52:09-05:00

US 7,476,849: Technique for monitoring and controlling a plasma process

Staff2021-02-05T10:48:20-05:00

US 7,453,059: Technique for monitoring and controlling a plasma process

Staff2021-02-02T09:57:01-05:00

US 20130052810: Engineering of Porous Coatings Formed by Ion–Assisted Direct Deposition

Staff2021-02-01T13:25:37-05:00

US 20130045339: Techniques for Diamond Nucleation Control for Thin Film Processing

Staff2021-02-02T11:05:56-05:00

US 20120309180: Method of Forming a Retrograde Material Profile Using Ion Implantation

Staff2021-02-02T10:42:01-05:00

US 20120295444: Techniques for Forming 3D Structures

Staff2021-02-01T13:21:04-05:00

US 20120288637: Method of Affecting Material Proprieties and Applications

Staff2021-02-02T10:46:28-05:00

US 20120263887: Technique and Apparatus for Ion-Assisted Atomic Layer Deposition

Staff2021-02-02T09:50:37-05:00

US 20120258583: Method for Epitaxial Layer Overgrowth

Staff2021-02-02T10:30:19-05:00

US 20120213941: Ion-assisted Plasma Treatment of a Three-dimensional Structure

Staff2021-02-01T13:12:39-05:00

US 20120137971: Hydrophobic Propriety Alteration using Ion Implantation

Staff2021-02-02T09:51:43-05:00

US 20120000421: Control Apparatus for Plasma Immersion Ion Implantation of Dielectric Substrate

Staff2021-02-02T11:15:40-05:00

US 20110309049: Techniques for Plasma Processing a Substrate

Staff2021-02-02T11:01:55-05:00

US 20110300696: Method for Damage-Free Junction Formation

Staff2021-02-02T11:19:38-05:00

US 20110253902: Molecular Ion Generation

Staff2021-02-02T09:51:03-05:00

US 20110039034: Pulsed deposition and recrystallization and tandem solar cell design utilizing crystallized/amorphous material

Staff2021-02-02T15:32:52-05:00

US 20100255683: Plasma Processing Apparatus

Staff2021-02-02T11:11:27-05:00

US 20100084583: Reduced Implant Voltage During Ion Implantation

Staff2021-02-01T13:03:27-05:00

US 20090124065: Particle Beam Assisted Modification Of Thin Film Materials

Staff2021-02-01T12:56:54-05:00

US 20090124064: Particle Beam Assisted Modification Of Thin Film Materials

Staff2021-02-02T15:24:32-05:00

US 20090084987: Charge Neutralization In a Plasma Processing Apparatus

Ludovic Godet2022-01-10T14:29:45-05:00

US 10,358,715: Integrated cluster tool for selective area deposition

Ludovic Godet2022-01-10T14:22:05-05:00

US 10,276,369: Material deposition for high aspect ratio structures

Ludovic Godet2022-01-10T14:16:23-05:00

US 10,204,764: Methods for forming a metal silicide interconnection nanowire structure

Ludovic Godet2022-01-10T13:35:28-05:00

US 10,203,604: Method and apparatus for post exposure processing of photoresist wafers

Ludovic Godet2022-01-10T13:31:49-05:00

US 10,192,775: Methods for gapfill in high aspect ratio structures

Ludovic Godet2022-01-10T13:28:35-05:00

US 10,167,574: Porous surface for biomedical devices

Ludovic Godet2022-01-10T13:24:12-05:00

US 10,157,740: Selective deposition process utilizing polymer structure deactivation process

Ludovic Godet2022-01-07T01:54:27-05:00

US 10,108,093: Controlling photo acid diffusion in lithography processes

Ludovic Godet2022-01-07T01:48:01-05:00

US 10,096,512: Gapfill film modification for advanced CMP and recess flow

Ludovic Godet2022-01-07T01:44:38-05:00

US 10,096,466: Pulsed plasma for film deposition

Ludovic Godet2022-01-07T01:39:53-05:00

US 10,048589: FGPEB application for photoresist microbridge defects,

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    Ludovic Godet

    LUDOVIC GODET

    • Head of R&D and Engineering
    • Managing Director Advanced Technology
    • Business Builder
    • Prolific Inventor
    • Ph.D. in Materials Science and Plasma Physics

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