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Ludovic Godet2022-01-10T14:22:05-05:00 US 10,276,369: Material deposition for high aspect ratio structures
Ludovic Godet2022-01-10T14:16:23-05:00 US 10,204,764: Methods for forming a metal silicide interconnection nanowire structure
Ludovic Godet2022-01-10T13:31:49-05:00 US 10,192,775: Methods for gapfill in high aspect ratio structures
Ludovic Godet2022-01-10T13:24:12-05:00 US 10,157,740: Selective deposition process utilizing polymer structure deactivation process
Ludovic Godet2022-01-07T01:48:01-05:00 US 10,096,512: Gapfill film modification for advanced CMP and recess flow
Ludovic Godet2022-01-07T01:39:53-05:00 US 10,048589: FGPEB application for photoresist microbridge defects,
Ludovic Godet2022-01-07T01:18:47-05:00 US 9,911,594: Selective atomic layer deposition process utilizing patterned SAM for 3D structure application
Ludovic Godet2022-01-07T00:55:46-05:00 US 9,852,902: Material deposition for high aspect ratio structures
Ludovic Godet2022-01-07T00:47:58-05:00 US 9,850,569: Ion implantation for superconductor tape fabrication
Ludovic Godet2022-01-07T00:37:07-05:00 US 9,823,570: Field guided post exposure bake application for photoresist microbridge defects
Ludovic Godet2022-01-05T02:00:20-05:00 US 9,777,378: Advanced Process flow for High Quality FCVD films
Ludovic Godet2022-01-05T01:56:10-05:00 US 9,773,675: 3D Materials Modification for Advanced Processing,
Ludovic Godet2022-01-05T01:49:39-05:00 US 9,767,987: Method and System for Modifying Substrate Relief Feature using Ion Implantation
Ludovic Godet2022-01-05T01:43:52-05:00 US 9,754,791: Selective Deposition Utilizing Mask and Directional Plasma Treatment
Ludovic Godet2022-01-05T01:04:41-05:00 US 9,620,407: 3D Material Modification for Advanced Processing
Ludovic Godet2022-01-04T23:38:56-05:00 US 9,595,467: Air Gap Formation in Interconnection Structure by Implantation Process
Ludovic Godet2022-01-04T23:41:46-05:00 US 9,553,174: Conversion Process Utilized for Manufacturing Advanced 3D Features for Semiconductor Device
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